bokee.net

销售总监/经理博客

正文 更多文章

SMT回流焊工艺中英文对照

SMT回流焊工艺中英文对照(表面贴装技术)
 
1. Fundamentals of Solders and Soldering (焊料及焊接基础知识)
Soldering Theory
(焊接理论)
Microstructure and Soldering
(显微结构及焊接)
Effect of Elemental Constituents on Wetting
(焊料成分对润湿的影响)
Effect of Impurities on Soldering
(杂质对焊接的影响)

2. Solder Paste Technology
(焊膏工艺)
Solder Powder (
锡粉 )
Solder Paste Rheology
(锡膏流变学)
Solder Paste Composition & Manufacturing
(锡膏成分和制造)

3. SMT Problems Occurred Prior to Reflow
(回流前 SMT 问题)
Flux Separation
(助焊剂分离 )
Paste Hardening
(焊膏硬化)
Poor Stencil Life
(网板寿命问题 )
Poor Print Thickness
(印刷厚度不理想)
Poor Paste Release From Squeegee
(锡膏脱离刮刀问题)
Smear
(印锡模糊)
Insufficiency
(印锡不足)
Needle Clogging
(针孔堵塞)
Slump
(塌落)
Low Tack
(低粘性)
Short Tack Time
(粘性时间短)

4. SMT Problems Occurred During Reflow
(回流过程中的 SMT 问题)
Cold Joints
(冷焊)
Nonwetting
(不润湿)
Dewetting
(反润湿)
Leaching
(浸析)
Intermetallics
(金属互化物)
Tombstoning
(立碑)
Skewing
(歪斜)
Wicking
(焊料上吸)
Bridging
(桥连)
Voiding
(空洞)

Opening
(开路)
Solder Balling(
锡球 )
Solder Beading
(锡珠)
Spattering
(飞溅)

5. SMT Problems Occurred at Post Reflow Stage
(回流后问题)
White Residue
(白色残留物)
Charred Residue
(炭化残留物)
Poor Probing Contact
(探针测接问题)
Surface Insulation Resistance or Electrochemical Migration Failure
(表面绝缘阻抗或电化迁移缺陷)
Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants
(分层 / 空洞 / 敷形涂覆或包封的固化问题)

6. Challenges at BGA and CSP Assembly and Rework Stage
BGA CSP 组装和翻修的挑战)
Starved Solder Joint
(少锡焊点)
Poor Self-Alignment
(自对位问题)
Poor Wetting
(润湿不良)
Voiding
(空洞)
Bridging
(桥连)
Uneven Joint Height
(焊点高度不均)
Open
(开路)
Popcorn and Delamination
(爆米花和分层)
Solder Webbing
(锡网)
Solder Balling
(锡球)

7. Problems Occurred at Flip Chip Reflow Attachment
(倒装晶片回流期间发生的问题)
Misalignment
(位置不准)
Poor Wetting
(润湿不良)
Solder Voiding
(空洞)
Underfill Voiding
(底部填充空洞)
Bridging
(桥连)
Open
(开路)
Underfill Crack
(底部填充裂缝)
Delamination
(分层)
Filler Segregation
(填充分离)
Insufficient Underfilling
(底部填充不充分)

8. Optimizing Reflow Profile via Defect Mechanisms Analysis
(回流曲线优化与缺陷机理分析)
Flux Reaction
(助焊剂反应)
Peak Temperature
(峰值温度)
Cooling Stage
(冷却阶段)
Heating Stage
(加热阶段)
Timing Considerations
(时间研究)
Optimization of Profile
(曲线优化)
Comparison with Conventional Profiles
(与传统曲线的比较)
Linear Ramp Up Profile(
斜坡式曲线 )
典型的表面贴装工艺分为三步:施加焊锡膏----贴装元器件-----回流焊接

工艺中不良现象中英文对照表
1.缺件(MISSING    PARTS)                              28.脚未弯(PIN NOT BENT)                              55.印章错误(WRONG STAMPS)
2.错件(WRONG PARTS)                                 29.缺盖章(MISSING STAMP)                           56.尺寸错误(DIMENSION WRONG)
3.多件(EXCESSIVE PARTS)                           30.缺标签(MISSING LABEL)                            57.二极管坏(DIODE NG)
4.短路(SHORT)                                                 31.缺序号(MISSING S/N)                                  58.晶体管坏(TRANSISTOR NG)
5.断路(OPEN)                                                     32.序号错(WRONG S/N)                                  59.振荡器坏(X’TL NG)
6.线短(WIRE SHORT)                                       33.标签错(WRONG LABEL)                             60.管装错误(TUBES WRONG)
7.线长(WIRE LONG)                                          34.标示错(WRONG MARK)                              61.阻值错误(IMPEDANCE WRONG)
8.拐线(WIRE POOR DRESS)                           35.脚太短(PIN SHORT)                                    62.版本错误(REV WRONG)
9.冷焊(COLD SOLDER)                                    36.J1不洁(J1 DIRTY)                                         63.电测不良(TEST FAILURE)
10.包焊或多锡(EXCESS SOLDER)                  37.锡凹陷(SOLDER SCOOPED)                    64.版本未标(NON REV LABEL)
11.空焊(MISSING SOLDER)                             38.线序错(W/L OF WIRE)                                  65.包装损坏(PACKING DAMAGED)
12.锡尖(SOLDER ICICLE)                                 39.未测试(NO TEST)                                         66.印章模糊(STAMPS DEFECTIVE)
13.锡渣(SOLDER SPLASH)                               40.VR变形(VR DEFORMED)                            67.标签歪斜(LABEL TILT)
14.锡裂(SODER CRACK)                                    41.PCB翘皮(PCB PEELING)                           68.外箱损坏(CARTON DAMAGED)
15.锡洞(PIN HOLE)                                               42.PCB弯曲(PCB TWIST)                                69.点胶不良(POOR GLUE)
16.锡球(SOLDER BALL)                                      43.零件沾胶(GLUE ON   PARTS)                    70.IC座氧化(SOCKET RUST)
17.锡桥(SOLDER BRIDGE)                        44.零件脚长(PARTS PIN LONG)                         71.缺UL标签(MISSING UL LABEL)
18.滑牙(SCREW LOOSE)                           45.浮件(PARTS LIFT)                                            72.线材不良(WIRE FAILURE)
19.氧化(RUST or OXIDIZED)                      46.零件歪斜(PARTS TILT)                                   73.零件脚损坏(PIN DAMAGED)
20.异物(FOREIGN MATERIAL)                   47.零件相触(PARTS TOUCH)          74.金手指沾锡(SOLDER ON GOLDEN FINGERS)
21.溢胶(EXCESSIVE GLUE)                       48.零件变形(PARTS DEFORMED)       75.包装文件错(RACKING DOC WRONG)
22.锡短路(SOLDER BRIDGE)                     49.零件损坏(PARTS DAMAGED)          76.包装数量错(PACKING Q’TY WRONG)
23.锡不足或少锡(SOLDER INSUFFICIENT)            50.零件脚脏(PIN DIRTY)          77.零件未定位(PARTS UNSEATED)
24.极性反(WRONG POLARITY)                    51.零件多装(PARTS EXCESS)           78.金手指沾胶(GLUE ON GOLDEN FINGERS)
25.脚未入(PIN UNSEATED)                          52.零件沾锡(SOLDER ON PARTS)       79.垫片安装不良(WASHER UNSEATED)
26.脚未出(PIN UNVISIBLE)                            53.零件偏移(PARTS SHIFT)                    80.线材安装不良(WIRE UNSEATED)
27.脚未剪(PIN NO CUT)                                  54.包装错误(WRONG PACKING)           81. 立碑(TOMBSTONE)
分享到:

上一篇:

下一篇: